Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly

By Firmstone M.G.   Bartholomew P.M.   Lowrie D.J.J.   Mannan S.H.   Hutt D.A.  

Soldering & Surface Mount Technology, Vol. 11, Iss. 1, 1999-01 ,pp. : 8-12

Emerald Group Publishing Ltd

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The effect of PECVD SiN moisture barrier layers on the degradation of a flip chip underfill material

By Kaltenpoth G.   Siebert W.   Xie X-M.   Stubhan F.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. : 12-15

Emerald Group Publishing Ltd

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The effects of bump height on the reliability of ACF in flip-chip

By Wu C.M.L.   Liu Johan   Yeung N.H.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 1, 2001-01 ,pp. : 25-30

Emerald Group Publishing Ltd

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Optimisation modelling for flip-chip solder joint reliability

By Stoyanov S   Bailey C   Cross M  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 49-58

Emerald Group Publishing Ltd

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Investigation of a solder bumping technique for flip-chip interconnection

By Hutt David A   Rhodes Daniel G   Conway Paul P   Mannan Samjid H   Whalley David C   Holmes Andrew S  

Soldering & Surface Mount Technology, Vol. 12, Iss. 1, 2000-01 ,pp. : 7-14

Emerald Group Publishing Ltd

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