Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 11,issue 3
Menu
Materials behaviour and the reliability in performance of solder joints
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.Survey of rework practices in the UK electronics assembly industry
By Wickham M.,Hunt C.P. in (1999)
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.Characterization of a solder paste printing process and its optimization
By Poon Gary K.K.,Williams D.J. in (1999)
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.Analysis of crack growth in solder joints
By Shangguan Dongkai in (1999)
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.Enhancement of underfill encapsulants for flip-chip technology
By Vincent M.B.,Wong C.P. in (1999)
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.PBGA solder ball coplanarity impact evaluation
By Huang Tony,Chu Joe in (1999)
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.Interfacial reactions of tin-zinc-bismuth alloys
Soldering & Surface Mount Technology,volume 11,issue 3 , Vol. 11, Iss. 3, 1999-12 , pp.