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JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 22-26

Springer Publishing Company

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Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation

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Communication: Formation of Intermetallic Compounds in SnPbAg, SnAg, and SnAgCu Solders on Ni/Au Metallization

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Creep deformation behavior of Sn-3.5Ag solder at small length scales

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