Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

By Pan Jianbiao   Chou Tzu-Chien   Bath Jasbir   Willie Dennis   Toleno Brian J.  

Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 32-37

Emerald Group Publishing Ltd

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Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints

By Lai Yi-Shao   Kao C.R.   Chang Hsiao-Chuan   Kao Chin-Li  

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 4-9

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

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Communication: Formation of Intermetallic Compounds in SnPbAg, SnAg, and SnAgCu Solders on Ni/Au Metallization

By Lee K.Y.   Li M.  

Metallurgical and Materials Transactions A, Vol. 32, Iss. 10, 2001-10 ,pp. : 2666-2668

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