Period of time: 2015年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 14,issue 2
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Intermetallic morphology around Ni particles in Sn-3.5Ag solder
By Lee J.G.,Guo F.,Subramanian K.N.,Lucas J.P. in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.By Arra Minna,Shangguan Dongkai,Ristolainen Eero,Lepistö Toivo in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.By Vianco P.T.,Rejent J.A. in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.Reliability of tin-lead balled BGAs soldered with lead-free solder paste
By Nurmi Sami Tapani,Ristolainen Eero Olavi in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.Solder ball failure mechanisms in plastic ball grid array packages
By Zhong C.H.,Yi S.,Whalley D.C. in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging
By Wu C.M. Lawrence,Chau M.L. in (2002)
Soldering & Surface Mount Technology,volume 14,issue 2 , Vol. 14, Iss. 2, 2002-07 , pp.