Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

By Arra Minna   Shangguan Dongkai   Ristolainen Eero   Lepistö Toivo  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 18-25

Emerald Group Publishing Ltd

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Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints

By Lai Yi-Shao   Kao C.R.   Chang Hsiao-Chuan   Kao Chin-Li  

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 4-9

Emerald Group Publishing Ltd

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

By Pan Jianbiao   Chou Tzu-Chien   Bath Jasbir   Willie Dennis   Toleno Brian J.  

Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 32-37

Emerald Group Publishing Ltd

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Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L.   Perovic D. D.   Rutter J. W.  

Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

Maney Publishing

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

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