Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

By Arra Minna   Shangguan Dongkai   Ristolainen Eero   Lepistö Toivo  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 18-25

Emerald Group Publishing Ltd

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

By Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 3, 2011-06 ,pp. : 150-160

Emerald Group Publishing Ltd

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The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

By Liu Weiping   Lee Ning-Cheng  

JOM, Vol. 59, Iss. 7, 2007-07 ,pp. : 26-31

Springer Publishing Company

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