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By Chen J B   Li C   Wu Y P  

Science and Technology of Welding & Joining, Vol. 17, Iss. 3, 2012-04 ,pp. : 237-243

Maney Publishing

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Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

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Emerald Group Publishing Ltd

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Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

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Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 76-83

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Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

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Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 28-38

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

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