Multiphysics simulation of microwave curing in micro-electronics packaging applications

Author： Tilford T.   Sinclair K.I.   Bailey C.   Desmulliez M.P.Y.   Goussettis G.   Parrott A.K.   Sangster A.J.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.19, Iss.3, 2007-07, pp. : 26-33

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