![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Nousiainen Olli Kangasvieri Tero Rönkä Kari Rautioaho Risto Vähäkangas Jouko
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.19, Iss.3, 2007-07, pp. : 15-25
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Vianco Paul Rejent Jerome Zender Gary Hlava Paul
Metallurgical and Materials Transactions A, Vol. 41, Iss. 12, 2010-12 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum
JOM, Vol. 56, Iss. 6, 2004-06 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)