An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature

Author: Liu De-Shin   Yeh Shu-Shen   Kao Chun-Teh   Huang Pay-Yau   Tsai Chia-I   Liu An-Hong   Ho Shu-Ching  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.22, Iss.4, 2010-09, pp. : 31-41

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Abstract