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Period of time: 2015年4期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 22,issue 4
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By Tao Bo,Yin Zhouping,Xiong Youlun in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
By Bukat K.,Sitek J.,Koscielski M.,Moser Z.,Gasior W.,Pstrus J. in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
Effects of multiple BGA rework on strength of solder joints
By Dariavach N.,Liang J.,Barr G.,Shangguan D. in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
By Liu De-Shin,Yeh Shu-Shen,Kao Chun-Teh,Huang Pay-Yau,Tsai Chia-I,Liu An-Hong,Ho Shu-Ching in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
By Mallik S.,Schmidt M.,Bauer R.,Ekere N.N. in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles
By Tai Feng,Guo Fu,Liu Jianping,Xia Zhidong,Shi Yaowu,Lei Yongping,Li Xiaoyan in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.![](/images/ico/ico5.png)
By Zeng Guang,Xue Songbai,Zhang Liang,Sheng Zhong,Gao Lili in (2010)
Soldering & Surface Mount Technology,volume 22,issue 4 , Vol. 22, Iss. 4, 2010-09 , pp.