Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls

By Liang J.   Dariavach N.   Callahan P.   Shangguan D.  

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 4-14

Emerald Group Publishing Ltd

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Reflow profile optimization of µ BGA solder joints considering reflow temperature and time coupling

By Bo Tao   Zhouping Yin   Han Ding   Yiping Wu  

Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 38-44

Emerald Group Publishing Ltd

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The impact of thermal cycling regime on the shear strength of lead-free solder joints

By Dusek Milos   Wickham Martin   Hunt Christopher  

Soldering & Surface Mount Technology, Vol. 17, Iss. 2, 2005-06 ,pp. : 22-31

Emerald Group Publishing Ltd

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Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

Springer Publishing Company

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Mechanical Strength of Thermally Aged Sn-3.5Ag/Ni-P Solder Joints

By He M.   Chen Z.   Qi G.J.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 65-75

Springer Publishing Company

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