Large AI/SiC Baseplate Packages for Digital and Microwave Applications*

Author: Lefeuvre A   Caplot **- M   Stranieri C   Massiot*** P  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.13, Iss.1, 1996-01, pp. : 26-30

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Abstract