Achieving Low Moisture Levels in Hermetic Packages containing Silver Glass with Organic Solvent Die Attach Materials

Author: Coupier P   Peltier J Ph.   Pilat E  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.14, Iss.3, 1997-03, pp. : 54-56

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract