Test chip and substrate design for flip chip microelectronic package thermal measurements

By Goh Teck Joo   Chiu Chia-Pin   Seetharamu K.N.   Quadir G.A.   Zainal Z.A.  

Microelectronics International, Vol. 23, Iss. 2, 2006-05 ,pp. : 3-10

Emerald Group Publishing Ltd

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Tomorrow's Packaging - Chip Scale Packaging vs Flip Chip*

By Boustedt K   Vardaman** E.J.  

Microelectronics International, Vol. 14, Iss. 3, 1997-03 ,pp. : 31-32

Emerald Group Publishing Ltd

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Thermosonic flip-chip bonding for SAW filter

By Tomioka T.   Iguchi T.   Mori I.  

Microelectronics Reliability, Vol. 44, Iss. 1, 2004-01 ,pp. : 149-154

Elsevier

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Assembly and Reliability of Very Large Flip-chip on CQFP*

By Clementi J J   Dearing** G 0   Bergeron*** C  

Microelectronics International, Vol. 13, Iss. 2, 1996-02 ,pp. : 5-8

Emerald Group Publishing Ltd

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A simple modification of a flip-chip bonder to allow large area chip attach

By Fuchs S   Rindelhardt K   Barrett J   Stam F  

Microelectronics International, Vol. 16, Iss. 1, 1999-01 ,pp. : 8-11

Emerald Group Publishing Ltd

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