Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices

Author: Lalinsky´ T   Haščík Sˇ.   Mozolová Ž.   Burian E   Krnáč M   Tomáška M   Škriniarová J   Drzˇík M   Kosticˇ I   Matay L  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.20, Iss.1, 2003-01, pp. : 43-47

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