Repeater insertion in global interconnects in VLSI circuits

By Chandel Rajeevan   Sarkar S.   Agarwal R.P.  

Microelectronics International, Vol. 22, Iss. 1, 2005-04 ,pp. : 43-50

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Width optimization of global inductive VLSI interconnects

By Kaushik Brajesh Kumar   Sarkar S.   Agarwal R.P.  

Microelectronics International, Vol. 23, Iss. 1, 2006-01 ,pp. : 26-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Analysis and optimization of shielded RLC global interconnects for gigascale integration

By  

International Journal of Electronics, Vol. 94, Iss. 3, 2007-03 ,pp. : 263-276

Taylor & Francis Ltd

Access to resources Recommend Favorite

Voltage scaling ‐ a novel approach for crosstalk reduction in global VLSI interconnects

By Kaushik B.K.   Sarkar S.   Agarwal R.P.   Joshi R.C.  

Microelectronics International, Vol. 24, Iss. 1, 2007-01 ,pp. : 40-45

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimal process parameters design for a wire bonding of ultra-thin CSP package based on hybrid methods of artificial intelligence

By Hung Yung-Hsiang  

Microelectronics International, Vol. 24, Iss. 3, 2007-07 ,pp. : 3-10

Emerald Group Publishing Ltd

Access to resources Recommend Favorite