The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad

Author： Xu Hui   Liu Changqing   Silberschmidt Vadim V.   Chen Zhong   Wei Jun  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.27, Iss.1, 2010-01, pp. : 11-16

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