Wafer damage issue study by heavy Al wire wedge bonding

Author： Zhang Hanmin Hu Ming Zong Fei Yin Baoguan Ye Denghong He Qingchun Wang Zhijie

ISSN： 1356-5362

Source： Microelectronics International, Vol.31, Iss.2, 2014-04, pp. : 129-136

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