Pressure indicating film characterization of pressure distribution in eutectic Au/Sn wafer-to-wafer bonding

Author： Spicer D.   Lai K.   Kornelsen K.   Brennan A.   Belov N.   Wang M.   Chou T-K.   Heck J.   Zhu T.   Akhlaghi S.  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.27, Iss.3, 2010-01, pp. : 135-139

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