Effects of Deposition Temperature on Low-Dielectric Fluorinated Amorphous Carbon Films for Ultralarge-Scale Integration Multilevel Interconnects

Author： Yang S-H. Park J. Kim J-Y. Lee Y-K. Cho B-R. Park D-K. Lee W-H. Park J-W.

Publisher： Elsevier

ISSN： 0026-265X

Source： Microchemical Journal, Vol.63, Iss.1, 1999-09, pp. : 161-167

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