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International Journal of Materials and Product Technology, Vol. 40, Iss. 3-4, 2011-04 ,pp. : 264-276

Inderscience Publishers

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The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

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Research on ultrasonically assisted electrochemical machining process

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Enhanced finite element model of ultrasonically assisted turning

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International Journal of Machining and Machinability of Materials, Vol. 6, Iss. 1-2, 2009-07 ,pp. : 159-173

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Voltage-assisted polymer wafer bonding

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