Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework

Author: Chien Chen-Fu   Hu Chih-Han   Lin Chi-Yung  

Publisher: Inderscience Publishers

ISSN: 1368-2148

Source: International Journal of Manufacturing Technology and Management, Vol.14, Iss.1-2, 2008-03, pp. : 130-144

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