Experiments on the aging of Sn–Ag–Cu solder alloys

Author： Snugovsky L.   Perovic D.D.   Rutter J.W.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.20, Iss.8, 2004-08, pp. : 1049-1054

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Abstract

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