Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

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Materials Science and Technology, Vol. 21, Iss. 1, 2005-01 ,pp. : 61-68

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Experiments on the aging of Sn–Ag–Cu solder alloys

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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

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Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

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Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

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