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International Journal of Materials and Product Technology, Vol. 39, Iss. 1-2, 2010-07 ,pp. : 95-107

Inderscience Publishers

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Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

By Snugovsky L.   Snugovsky P.   Perovic D. D.   Sack T.   Rutter J. W.  

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Experiments on the aging of Sn–Ag–Cu solder alloys

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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

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Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

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