Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

By Li F. Q.   Wang C. Q.   Tian Y. H.  

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Maney Publishing

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Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

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Solidification and microstructure of eutectic Pb–Sn microsolder bonds

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Diffusion controlled reactions in Au/Pb–Sn solder system

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Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

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