High volume, low cost flip chip assembly on polyester flex

By Gilleo Ken   Boyes Bob   Corbett Steve   Larson Gary   Price Dave  

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 11-17

Emerald Group Publishing Ltd

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Using computer models to identify optimal conditions for flip-chip assembly and reliability

By Bailey Christopher   Lu Hua   Glinski Greg   Wheeler Daniel   Hamilton Phil   Hendriksen Mike   Smith Brian  

Circuit World, Vol. 28, Iss. 1, 2002-10 ,pp. : 14-20

Emerald Group Publishing Ltd

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Flip Chip Rework Process

By Vasan S.V.   Truong P.T.   Dody G.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 16-24

Emerald Group Publishing Ltd

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A novel flip-chip interconnection process for integrated circuits

By Sugden Mark W.   Hutt David A.   Whalley David C.   Liu Changqing  

Circuit World, Vol. 38, Iss. 4, 2012-11 ,pp. : 214-218

Emerald Group Publishing Ltd

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X-ray Inspection of Flip Chip Attach Using Digital Tomosynthesis

By Rooks S.   Sack T.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 51-55

Emerald Group Publishing Ltd

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