Top-down silicon microcantilever with coupled bottom-up silicon nanowire for enhanced mass resolution

By Vidal-Álvarez Gabriel   Agustí Jordi   Torres Francesc   Abadal Gabriel   Barniol Núria   Llobet Jordi   Sansa Marc   Fernández-Regúlez Marta   Pérez-Murano Francesc   Gottlieb Oded   Vidal-Álvarez Gabriel  

Nanotechnology, Vol. 26, Iss. 14, 2015-04 ,pp. : 145502-145510

IOP Publishing

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A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging

By Du Li   Shi Tielin   Su Lei   Xue Dongmin   Liao Guanglan  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 4, 2015-04 ,pp. : 45005-45011

IOP Publishing

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Erratum: Top-down silicon microcantilever with coupled bottom-up silicon nanowire for enhanced mass resolution (2015 Nanotechnology 26 145502)

By Vidal-Álvarez Gabriel   Agustí Jordi   Torres Francesc   Abadal Gabriel   Barniol Núria   Llobet Jordi   Sansa Marc   Fernández-Regúlez Marta   Pérez-Murano Francesc   Gottlieb Oded   Vidal-Álvarez Gabriel  

Nanotechnology, Vol. 26, Iss. 25, 2015-06 ,pp. : 259601-259601

IOP Publishing

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Shape-Selective Assembly of Anisotropic, Deformable Microcomponents Using Bottom-Up Micromanufacturing

By Agarwal Gunjan   Livermore Carol  

Micromachines, Vol. 7, Iss. 4, 2016-04 ,pp. : 68-68

MDPI

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Bottom-up fabrication of graphene on Ru(0001) via molecular self-assembly

By Cai Yiliang   Zhang Hanjie   Song Junjie   Zhang Yuxi   Rehman A U   He Pimo  

Nanotechnology, Vol. 26, Iss. 29, 2015-07 ,pp. : 295601-295608

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