Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

Author： Peter Daniel Dalmer Michael Lechner Alfred Gigler Alexander M Stark Robert W Bensch Wolfgang

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.21, Iss.2, 2011-02, pp. : 25001-25006

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Fuzzy eigensolutions of mechanical structures

By Massa F Lallemand B Tison T Level P

Engineering Computations: Int J for Computer-Aided Engineering, Vol. 21, Iss. 1, 2004-01 ,pp. : 66-77

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Internal mechanical stresses in hot air drying

By Afanas’ev A. Konyagin I. Mikhailov V. Siplivyi B.

Theoretical Foundations of Chemical Engineering, Vol. 39, Iss. 1, 2005-01 ,pp. : 92-97

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Measurement of physical and mechanical properties of beeswax

By Morgan J. Townley S. Kemble G. Smith R.

Materials Science and Technology, Vol. 18, Iss. 4, 2002-04 ,pp. : 463-467

Maney Publishing

Access to resources Recommend Favorite

Robustness assessment for progressive collapse of framed structures using pushdown analysis methods

By Lu Da-Gang

International Journal of Reliability and Safety, Vol. 6, Iss. 1-2, 2012-12 ,pp. : 15-37

Inderscience Publishers

Access to resources Recommend Favorite

Improving Stability of FCC Gasoline Using Ionic Liquids Catalyst After Treating

By Zhi-Rong Gao Ke-Jian Liao Dao-Sheng Liu Yue-Ling Dai

Petroleum Science and Technology, Vol. 23, Iss. 7-8, 2005-01 ,pp. : 1001-1008

Taylor & Francis Ltd

Access to resources Recommend Favorite