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Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

By Peter Daniel,Dalmer Michael,Lechner Alfred,Gigler Alexander M,Stark Robert W,Bensch Wolfgang in (2011)

IOP Publishing

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Mechanics and scaling of thin part assembly at a fluidic interface

By ,Xiong Xugang,Baskaran Rajashree,Böhringer Karl F in (2011)

IOP Publishing

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Non-monotonic pressure dependence of resonant frequencies of microelectromechanical systems supported on squeeze films

By Tung Ryan C, ,Sumali Hartono,Raman Arvind in (2011)

IOP Publishing

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Bidimensional codes recorded on an oxide glass surface using a continuous wave CO₂ laser

By Andreeta M R B,Cunha L S,Vales L F,Caraschi L C,Jasinevicius R G in (2011)

IOP Publishing

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Microchannel formation through Foturan® with infrared femtosecond and ultraviolet nanosecond lasers

By Fernández-Pradas J M,Serrano D,Morenza J L,Serra P in (2011)

IOP Publishing

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A model for squeeze-film damping of perforated MEMS devices in the free molecular regime

By Li Pu,Hu Rufu in (2011)

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Quality-factor amplification in piezoelectric MEMS resonators applying an all-electrical feedback loop

By Manzaneque T,Hernando-García J,Ababneh A,Schwarz P,Seidel H,Schmid U,Sánchez-Rojas J L in (2011)

IOP Publishing

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Microfluidics in silicon/polymer technology as a cost-efficient alternative to silicon/glass

By Kalkandjiev K,Riegger L,Kosse D,Welsche M,Gutzweiler L,Zengerle R,Koltay P in (2011)

IOP Publishing

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Surface activation-based nanobonding and interconnection at room temperature

By Howlader M M R,Yamauchi A,Suga T in (2011)

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SU-8 serial MEMS switch for flexible RF applications

By Chao Tzu-Yuan,Hsu M C,Lin C-D,Cheng Y T in (2011)

IOP Publishing

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