Curved in-plane electromechanical relay for low power logic applications

Author: Grogg Daniel   Drechsler Ute   Knoll Armin   Duerig Urs   Pu Yu   Hagleitner Christoph   Despont Michel  

Publisher: IOP Publishing

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.23, Iss.2, 2013-02, pp. : 25024-25031

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