3D topography evolution of micro cracks of subsurface damages during etching process

Author: Wang Hairong   Guan Cheng   Zhang Bike   Zhang Huan   Yuan Guoying  

Publisher: Inderscience Publishers

ISSN: 1746-9392

Source: International Journal of Nanomanufacturing, Vol.9, Iss.5-6, 2013-11, pp. : 446-456

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Abstract