Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

Author: Shen Jun   Tang Qin   Pu Yayun   Zhai Dajun   Cao Zhongming   Chen Jie  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.24, Iss.12, 2013-12, pp. : 4881-4887

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