Modeling and calculation of slurry-chemistry effects on chemical–mechanical planarization with a grooved pad

ISSN： 0022-0833

Source： Journal of Engineering Mathematics, Vol.63, Iss.1, 2009-01, pp. : 33-50

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

A theory of pad conditioning for chemical-mechanical polishing

By Borucki Leonard J. Witelski Thomas Please Colin Kramer Peter R. Schwendeman Donald

Journal of Engineering Mathematics, Vol. 50, Iss. 1, 2004-09 ,pp. : 1-24

Springer Publishing Company

Access to resources Recommend Favorite

Stochastic Models for Pad Structure and Pad Conditioning Used in Chemical-Mechanical Polishing

By Wiegand Susanne Stoyan Dietrich

Journal of Engineering Mathematics, Vol. 54, Iss. 4, 2006-04 ,pp. : 333-343

Springer Publishing Company

Access to resources Recommend Favorite

Mathematical modeling of polish-rate decay in chemical-mechanical polishing

By Borucki L.

Journal of Engineering Mathematics, Vol. 43, Iss. 2-4, 2002-08 ,pp. : 105-114

Springer Publishing Company

Access to resources Recommend Favorite

Analytical solution for polish-rate decay in chemical–mechanical polishing

By Shi Hong Ring Terry

Journal of Engineering Mathematics, Vol. 68, Iss. 2, 2010-10 ,pp. : 207-211

Springer Publishing Company

Access to resources Recommend Favorite

Feature-Scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics

Communications in Computational Physics, Vol. 16, Iss. 5, 2014-11 ,pp. : 1389-1418

Cambridge University Press

Access to resources Recommend Favorite