Effect of thermal annealing on the microstructure of ytterbium-implanted silicon wafers

Author: Yang Y.   Chen H.   Zhou Y.Q.   Li F.H.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.32, Iss.24, 1997-12, pp. : 6665-6670

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content