Study on electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

Author： Latt K.M.   Lee Y.K.   van Kan J.A.   Mahabai A.A.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.36, Iss.22, 2001-11, pp. : 5475-5480

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