Surface activated bonding of LCP/Cu for electronic packaging

Author： Howlader M.   Suga T.   Takahashi A.   Saijo K.   Ozawa S.   Nanbu K.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.40, Iss.12, 2005-06, pp. : 3177-3184

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