Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints

Author： SOBCZAK N. SOBCZAK J. NOWAK R. KUDYBA A. DARLAK P. MIKULOWSKI B. WOJCIECHOWSKI A.

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.40, Iss.9-10, 2005-05, pp. : 2547-2551

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