Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders

By  

Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. : 466-472

Trans Tech Publications

Access to resources Recommend Favorite

Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions

By Zhang Ning   Shi Yaowu   Guo Fu   Lei Yongpei   Xia Zhidong   Tian Li  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 10, 2010-10 ,pp. : 1076-1082

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

Springer Publishing Company

Access to resources Recommend Favorite

Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

By Yang Shihua   Tian Yanhong   Wang Chunqing  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 11, 2010-11 ,pp. : 1174-1180

Springer Publishing Company

Access to resources Recommend Favorite

Experimental investigation of the Nb-Ni phase diagram

By Chen Hailin   Du Yong   Xu Honghui   Liu Yong   Schuster J.  

Journal of Materials Science, Vol. 40, Iss. 22, 2005-11 ,pp. : 6019-6022

Springer Publishing Company

Access to resources Recommend Favorite