Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

Author： Cheng Fangjie   Gao Feng   Zhang Jianyou   Jin Wenshan   Xiao Xin  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.46, Iss.10, 2011-05, pp. : 3424-3429

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

By Shohji Ikuo   Yoshida Tomohiro   Takahashi Takehiko   Hioki Susumu  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 219-223

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

By Zhu Fulong   Zhang Honghai   Guan Rongfeng   Liu Sheng  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 5, 2006-05 ,pp. : 379-384

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder

By  

Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. : 456-461

Trans Tech Publications

Access to resources Recommend Favorite

Liquidus and Wettablity of Lead-Free Solder Alloys

By  

Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. : 462-465

Trans Tech Publications

Access to resources Recommend Favorite

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

By Tian Yanhong  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

Springer Publishing Company

Access to resources Recommend Favorite