Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 31-40

Springer Publishing Company

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Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy

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Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1709-1714

Springer Publishing Company

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The effect of mechanical constraint on the flow and fracture of 6337 SnPb eutectic alloy

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Dependence of frequency on Young's modulus and internal friction in Sn–9Zn and Sn–3.5Ag eutectic lead-free solders

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Effects of addition of copper particles of different size to Sn-3.5Ag solder

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