Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin–lead based solders

Author： Zhang X. P.   Wang H. W.   Shi Y. W.  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.15, Iss.8, 2004-08, pp. : 511-517

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