Correlation between thermal diffusivity and activation energy of ordering of lead free solder alloys Sn65−xAg25Sb10Cux rapidly solidified from molten state

Author： Shalaby R.  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.16, Iss.4, 2005-04, pp. : 187-191

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