Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

Author： Kim Dae-Gon   Jang Hyung-Sun   Jung Seung-Boo  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.16, Iss.8, 2005-08, pp. : 523-528

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