Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Author： Zhang X.   Yu C.   Shrestha S.   Dorn L.  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.18, Iss.6, 2007-06, pp. : 665-670

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