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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 14-21

Springer Publishing Company

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Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

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Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 9, 2010-09 ,pp. : 910-916

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Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

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Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

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