Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

Springer Publishing Company

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Effects of addition of copper particles of different size to Sn-3.5Ag solder

By Nadia Aemi  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 86-93

Springer Publishing Company

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Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

By Shen Jun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

Springer Publishing Company

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Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder

By Gao Lili   Xue Songbai   Zhang Liang   Sheng Zhong   Zeng Guang   Ji Feng  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 7, 2010-07 ,pp. : 643-648

Springer Publishing Company

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Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

By Wang Mingna  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 148-155

Springer Publishing Company

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