Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression

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Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

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Effects of addition of copper particles of different size to Sn-3.5Ag solder

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

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